VIZTA will develop innovative technologies for optical sensors and laser sources used in short to long-range 3D-imaging. The project will demonstrate the value of these technologies in several key applications including automotive, security, smart buildings, mobile robotics for smart cities, and industry4.0.
The key differentiating Silicon sensing technologies developed during VIZTA are:
- innovative Silicon single-photon avalanche diode technology, based on a dedicated 12-inch process and intended for direct Time-of-Flight applications;
- pioneering lock-in pixel technology based on an advanced 12-inch CMOS process and intended for indirect Time-of-Flight applications;
- ground-breaking and cost-effective 12-inch wafer level optics, including the development of Near Infra-Red (NIR) bandpass thin-film filters, no angle-shift NIR bandpass filters, RGB+Z on-chip filtering solution, micro-lenses solution for both depth sensing and RGB+Z;
- and complex RGB+Z pixel architectures for multimodal 2D/3D imaging.
VIZTA is a prime opportunity for placing Europe in a leadership position for advanced imaging sensors, laser sources, and systems. This will be achieved through the mastering of the complete value chain from silicon and III-V material technologies up to end-users. VIZTA will strengthen innovation capacity, competitiveness and sustainability of its consortium and positively impact European economy by enabling large volume imagining sensors and laser sources productions in Europe, and in consequence creating and maintaining employment. The project will also reinforce links between the large companies and the SMEs embedded in the project to explore new markets with early provision of state-of-the-art 3D sensors, and enable equipment suppliers to keep leadership and market share.