The TAKEMI5 project discovers, develops and demonstrates lithographic, metrology, process and integration technologies enabling module integration for the 5nm node. The project enables innovations to support the expected growth of needs of private persons, companies, public organizations and to provide better options to address the main societal challenges and the internet of thing infrastructure.
This main objective is realised with available EUV/NA 0.33 scanners that are optimized for mix & match with existing DUV/NA 1.35 scanners, and with system design, development and integration of a new hyper NA EUV lithography tool to enable more single exposure patterning for the 5nm node to create complex integrated circuits.
Process steps to achieve module integration in Front-end, Middle and Back-end of line are discovered and developed using the most advanced tool capabilities and they are evaluated morphologically and electrically. During the development, specific challenges in metrology are assessed and metrology tools are upgraded or newly developed. The results are demonstrated in the imec pilot line with qualified metrology tools enabling module integration at the 5nm node.
The TAKEMI5 project relates to the ECSEL work program topic Process technologies – More Moore. It addresses and targets (disruptive) new Semiconductor Process, Equipment and Materials solutions for advanced CMOS processes that enable the module integration of electronic devices for the 5nm node in high-volume manufacturing and fast prototyping. The project touches the core of the continuation of Moore’s law, which has celebrated its 50th anniversary. The cost aware development process supports the involved companies, and places them in an enhanced position compared to their worldwide competition.