iRel40 has the ultimate goal of improving reliability for electronic components and systems by reducing failure rates along the entire value chain.
IT2
Call year: 2019
Semiconductor research and development continuously focuses on surpassing present state-of-the-art Micro-Chips manufacturing technology to accommod
VALU3S
Call year: 2019
VALU3S aims to design, implement and evaluate state-of-the-art V&V methods and tools in order to reduce the time and cost needed to verify and validate automated systems with respect to safety, cybersecurity and privacy (SCP) requirements.
MADEin4
Call year: 2018
Metrology Advances for Digitized Electronic Components and Systems Industry 4.0
PIN3S
Call year: 2018
Pilot Integration of 3nm Semiconductor Technology.
Power2Power
Call year: 2018
Power2Power fosters a holistic, digitised pilot line approach in the Power ECS domain by accelerating the transition of ideas to innovations.
5G_GaN2
Call year: 2017
The fifth generation (5G) communications technologies will provide internet access to a wide range of applications.
AFarCloud
Call year: 2017
It will provide a distributed platform for autonomous farming, which will allow the integration and cooperation of Cyber Physical Systems in real-time.
EuroPAT-MASIP
Call year: 2017
Semiconductor packaging, assembly and test involve most of the semiconductor value chain, ranging from material suppliers to software design and packaging foundries to test houses.
HiPERFORM
Call year: 2017
Wide band-gap power electronics in the drivetrain of electric vehicles.
I-MECH
Call year: 2017
Intelligent Motion Control Platform for Smart Mechatronic Systems
OCEAN12
Call year: 2017
For the last years, electronic components become more and more widespread in the automotive industry.
PRYSTINE
Call year: 2017
Fail-operational Urban Surround Perception (FUSION) based on robust Radar and LiDAR sensor fusion and control functions.
R3-POWERUP
Call year: 2017
300mm Pilot Line for Smart Power and Power Discretes.
TAKEMI5
Call year: 2017
Discovering, developing and demonstrating lithographic, metrology, process and integration technologies enabling module integration for the 5nm node.
TAPES3
Call year: 2017
Supporting the continuation of Moore’s law in line with the worldwide industry roadmap.
TARANTO
Call year: 2017
Towards Advanced bicmos NanoTechnology platforms for rf to thz applications.
WAKeMeUP
Call year: 2017
WAKeMeUP will set-up a pilot line for advanced microcontrollers with e
AMASS
Call year: 2016
Open tool platform, ecosystem & self-sustainable community for assurance and certification of Cyber-Physical Systems.
IoSense
Call year: 2016
Boosting European ECS industry competitiveness with connected semiconductor pilot lines in Europe.
TAKE5
Call year: 2016
5nm patterning, supporting the International Technology Roadmap for Semiconductors.
3CCAR
Call year: 2015
3Ccar addresses the ever growing complexity in mobility systems, especially in Electrified Vehicles (EV).
EnSO
Call year: 2015
Autonomous Micro Energy Sources (AMES) for the “Internet of Things” (IoT)
InForMed
Call year: 2015
A pilot line for micro-fabricated medical devices enabling optimal use of the technologies and competencies available in Europe
OSIRIS
Call year: 2015
OSIRIS proposes a large improvement of Silicon Carbide (SiC) wafers.
PowerBase
Call year: 2015
Strenghtening growth and strategic independence for European semiconductor industry
PRIME
Call year: 2015
The goal of PRIME is to establish an open Ultra Low Power technology platform, containing all necessary design and architecture blocks and components needed to support supply of products for the IoT.
R2POWER300
Call year: 2015
Pilot line for new generations of Smart Power and Discrete technologies
REFERENCE
Call year: 2015
Today’s world is overwhelmingly digitalized. The integration of information and communication technologies in people’s lives is unprecedented, and the volume of data being constantly exchanged is growing drastically.
SeNaTe
Call year: 2015
Paving the way to the nano-structuring of electronic devices with 7nm resolution in high-volume manufacturing and fast prototyping.
Completed
WAYTOGO FAST
Call year: 2015
Distributed research infrastructure in the nanoCMOS domain influencing the whole value chain of digital electronics in Europe.
ADMONT
Call year: 2014
Advanced Distributed Pilot Line for More-than-Moore Technologies.
