Shaping Digital Innovation

Electronic Components and Systems for European Leadership

Ecsel So Far

10

Calls
53

Projects
More than
1600

participations
2.6 bn€

RDI cost
1.2 bn€

EU and National funding
1.4 bn€

industries own financing

Highlighted

The three Calls for 2019 are now open! First deadlines are:
For H2020-ECSEL-2019-3-CSAHealth.E, at 17:00:00 Brussels time (CET) on 27 March 2019
For H2020-ECSEL-2019-1-IA and H2020-ECSEL-2019-2-RIA, at 17:00:00 Brussels time (CET) on 7 May 2019

30 January 2019

Advanced Metrology & Characterisation for 3D CMOS

Workshop inthe frame of the 3DAM ECSEL JU project

07 January 2019

ECSEL "SWARMS" Project publishes results summary

SWARMS is an ECSEL JU funded project that has developed an intelligent platform that enhances accessibility and autonomy of unmanned underwater vehicles.

18 December 2018

Minima Processor enters into partnership with and NXP Semiconductors

The ECSEL JU “Things2Do” project start-up Minima Processor, just announced a newly established partnership with NXP Semiconductors N.V.

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ECSEL_JU - February 19

RT @alebagnato: Researchers working in @H2020 @ITEA_3 @ECSEL_JU @ARTEMIS_IA submit your project achievements at @STAFconferences #STAF2019…

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ECSEL_JU - February 19

RT @ENABLE_S3: Enable-S3 project partner GMV will present "HW-RECONFIGURABLE PROCESSING AVIONICS FOR SPACE VISION-BASED NAVIGATION" next…

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ECSEL_JU - February 12

Tune in for our free interactive webinar on #ECSELJU Calls for 2019! We will cover project idea submission process… t.co/fpum8rMBFm

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ECSEL_JU - February 01

RT @ARTEMIS_IA: In our magazine @KhalilRouhana stresses the importance of lining up the strategies of the Member States & the Commission, a…

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ECSEL_JU - January 16

RT @ARTEMIS_IA: Day 2 of the ECS Brokerage starts with a session on calls of relevance for the SSI community and an overview of the @EU_H20…

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ECSEL_JU - January 15

Yves Gigase of @ECSEL_JU on stage at the #ECS Brokerage 2019 presenting #ECSELJU Calls 2019 & conditions to apply f… t.co/RD4pIyxSGt

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ECSEL_JU - January 15

RT @AENEAS_EU: At the #ECS Brokerage Event, the 2019 update of the joint @AENEAS_EU @ARTEMIS_IA @EPoSS_news, ECS-SRA has been presented. It…

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ECSEL_JU - January 15

Starting right now: #ECS Brokerage 2019 in Brussels by @AENEAS_EU @ARTEMIS_IA & @EPoSS_news. #ECSELJU is here too -… t.co/DN3sNsRPdP

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ECSEL_JU - January 15

RT @AENEAS_EU: 15-16 Jan 2019: @AENEAS_EU @ARTEMIS_IA @EPoSS_news are hosting the Electronic Components & Systems ECS Brokerage Event in Br…

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ECSEL_JU - January 15

RT @AENEAS_EU: Ready for the #ECS Brokerage Event to meet new partners, create consortia and get your RD&I project funded? Find out mor…

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ECSEL_JU - January 10

RT @AENEAS_EU: At the #ECS Brokerage Event, the 2019 update of the joint @AENEAS_EU @ARTEMIS_IA @EPoSS_news ECS-SRA will be presented. It s…

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ECSEL_JU - January 10

RT @EUTenders: .@ECSEL_JU #tenders Organisation of the #ECSEL_JU Symposium 2019 for European industry and research communities - 14.1.19 -…

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ECSEL_JU - January 09

RT @ARTEMIS_IA: Almost a year on from its first publication, the ECS SRA has been updated. @patrick_cogez, Technical Programme Manager at @…

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ECSEL_JU - December 18

RT @GOettingerEU: Big step today for @microelectronics: @EU_Commission approved first important project of common European Interest. France…

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ECSEL_JU - December 17

Dear Friends, the #ECSELJU team wishes you happiness and joy for the coming holiday and the whole of 2019! Looking… t.co/DqHnsGwsTt

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What we do?

ECSEL JU funds Research, Development and Innovation projects in Electronic Components and Systems, engaging finances from the EU, countries and participants for innovative activities that make a real difference in our society and your personal life.

Exploreby

Key applications

Smart production

Smart health

Smart energy

Smart society

Smart mobility

Essential capabilities

Smart systems integration

Design technology

Safety and security

Cyber physical systems

Semicon process equipment materials

Ecsel So Far

Highlighted

News

Advanced Metrology & Characterisation for 3D CMOS

ECSEL "SWARMS" Project publishes results summary

Minima Processor enters into partnership with and NXP Semiconductors

What we do?

Key applications

Essential capabilities