ECSEL So Far

  • 10
    Calls
  • 64
    Projects
  • More than
    2100
    participations
  • 3.4 bn€
    RDI cost
  • 1.6 bn€
    EU and National funding
  • 1.8 bn€
    Industries' own financing

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Discover, network, learn and shape ‘Our Digital Future’ together at the European Forum for Electronic Components and Systems (EFECS) 2019! The third edition of this international forum, serving the Electronic Components and Systems (ECS) Community in Europe, will take place on 19-21 November 2019 at the Finlandia Hall in Helsinki. This event is organized jointly by ECSEL Joint Undertaking, AENEAS, ARTEMIS-IA, EPoSS, and the European Commission.

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What we do?

ECSEL JU funds Research, Development and Innovation projects in Electronic Components and Systems, engaging finances from the EU, countries and participants for innovative activities that make a real difference in our society and your personal life.
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Key applications

Smart production

Smart health

Smart energy

Smart society

Smart mobility

Essential capabilities

Smart systems integration

Design technology

Safety and security

Cyber physical systems

Semicon process equipment materials